Analysis and comparison of common test methods for PCBA in SMT chip processing industry

** Source of the article ： Jiangxi yingteli
Smt Patch processing , At present, the common test methods in the industry are AOI、ICT、FCT Wait three blocks , In addition, a few factories use x-ray, But less , Next, Jiangxi Inteli technology will give you an analysis pcba Common test methods AOI/ICT/FCT The advantages and disadvantages of the three methods , At present, these three methods have their own advantages and disadvantages , Therefore, one method cannot replace the other two , For your reference only .

AOI

With the development and maturity of Technology ,AOI Gradually it was very SMT Used in the production line , It is checked by using an optical camera , Need to have a standard sample that is considered a good product and record its photos , Then other boards are compared with the image of the standard template to judge whether it is good or bad .

AOI Basically, you can judge pcba Are there any missing parts on the board 、 tombstone 、 Wrong parts 、 The offset 、 Connecting bridge 、 Empty welding and other defects ; However, the soldering effect under the electronic components cannot be recognized , Such as BGA IC or QFN IC, If the electronic components have slight appearance cracks, it is difficult to AOI To identify .

commonly AOI The misjudgment rate is very high , It takes an experienced engineer to adjust the machine for a period of time before it can be stable . Therefore, when the new board is imported at the initial stage, more manpower is required to re judge AOI Think whether the problem board is really a problem . Related reading ： What is? AOI？ Explain the automatic optical detection equipment in detail aoi

ICT

ICT It is a more traditional test method , The electrical characteristics of all components can be tested by the test point , Some advanced testing machines can even run programs on the circuit board to be tested , Do some functional tests that can be run by the program . Can identify missing parts 、 tombstone 、 Wrong parts 、 Bridge 、 Polarity reversal , Its disadvantage is that there must be enough space on the circuit board to place the test points , If the fixture is not designed properly , It will damage the electronic parts on the circuit board or even the circuit in the circuit board due to mechanical action . Extended reading ：SMT industry AOI,X-RAY,ICT What are the differences ？ Role is ？

FCT

Traditional functional testing (FCT) Method , The function test can not know whether the characteristics of electronic parts meet the original requirements ; The function test shall be able to find out the weldability of all parts 、 Wrong parts 、 Bridge 、 Short circuit and so on , But empty 、 false 、 The problem of cold welding may not be completely measurable .

Through the above comparison , You can roughly know AOI/ICT/FCT And other test methods , Different test equipment has different advantages and disadvantages , If you want to BGA/QFN And other electronic components pin soldering effect detection , You need to use x-ray equipment ,x-ray Can pass pcba The soldering quality of the internal pins can be seen from the perspective of the board surface , In avionics 、 Automotive electronics and other industries have a great influence on product reliability 、 Industries that require very high stability , Chip processing plants need to consider such equipment .

Jiangxi yingteli is a leader in the chip processing industry in Jiangxi , All devices can be accessed mes System , Provide customers with product traceability management , It has complete chip mounting equipment 、DIP And quality production control system , All the equipment are imported high-end equipment , With very high pcba Processing quality , It can provide customers with high-quality products and services , At the same time, we provide customers with fast delivery service .
Source of the article ： Jiangxi yingteli Electronics Co., Ltd