High speed ASIC packaging trends: integration, SKU and 25g+

It can be seen from the above table that , Chip packaging performance is mainly shown in the following aspects ：

• Number of transistors
• Package size
• The core number
• Storage
• Interface ( Storage interface 、HOST Interface 、PCIE Interface and SATA Interface )

ASIC Package driven package technology

The influence of impedance discontinuity on packaging performance

Effect of rise time on impedance discontinuity

Package information and simulation conditions

encapsulation TX Eye pattern simulation