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Hardware development notes (VIII): basic process of hardware development, making a USB to RS232 module (VII): creating a basic dip component (crystal oscillator) package and associating the principle
2022-06-29 13:56:00 【51CTO】
Preface
With the schematic diagram , Can design hardware PCB, In the design PCB There is also a coordinated priority action , Mapping encapsulation , The components of the schematic library are designed by us . In order to better describe the packaging design process , This article describes creating a crystal oscillator package (DIP), Connect the components of the schematic diagram to the pin package .
<br>
Schematic packaging analysis

- Serial number 1:USB Port packaging , see datasheet establish
- Serial number 2:CON encapsulation , Use dip2.54,2dip
- Serial number 3:ASM1117-3.3V encapsulation , see datasheet establish
- Serial number 4:CON encapsulation , Use dip2.54,3dip
- Serial number 5: Capacitor package , choose 0603 establish
- Serial number 6:CH340G encapsulation , see datashee establish
- Serial number 7: Crystal oscillator package , see datasheet establish
- Serial number 8:MAX232 Component packaging , see datasheet establish
- Serial number 9:CON encapsulation , Use dip2.54,5dip
above , Actually com There is a universal ,0603 These are also general standard packages .
<br>
Create crystal oscillator package
Package dimension drawing of crystal oscillator

dip And patch , We chose dip Of .
establish Pad Pad ( circular , Outside diameter 1.5mm, The inner diameter 1.0mm)
No need to create , General dip All are 0.6 Left and right , The previous ones can be used in general :

<br>
Create component packaging











<br>
Schematic Association encapsulation
Step one : Open the schematic project


Step two : Double click the component to add the package


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