Comparison of advantages and disadvantages between SD NAND and EMMC

  Recently, we have come into contact with some customers , Originally, the customer planned to use eMMC, But I always feel dissatisfied . Later, I made in-depth communication with customers . What do you really want eMMC Well ？ The answers they give are ： The smallest eMMC; The most convenient for welding eMMC; Minimum capacity eMMC; pin With the fewest feet eMMC; The lowest power consumption eMMC; Erase the one with the longest life eMMC; Use SLC NAND Wafer eMMC; The most stable eMMC etc. . 　　

We analyzed according to the requirements of customers , Think CS creation SD NAND More suitable for these customers .CS creation SD NAND It's a mini eMMC; 68mm Small size ; Minimum capacity 128MB, Better cost ; 8pin foot , Easy to weld ; built-in SLC wafer ,10 Ten thousand erasures ; compatible SDIO, Stick and use ; SD NAND and eMMC On the architecture , Like a brother , All built-in NAND Flash wafer +NAND Flash controller +Firmware. 　　

About CS creation SD NAND For details, please refer to the link ：​ ​http://www.longsto.com/product/31.html. that SD​​​ NAND and eMMC What are the differences ？ Put... Here CS creation SD NAND and eMMC Features are listed ： 　　

It can be seen that customers have the following needs , choice SD NAND than eMMC More suitable : 　　

1： Need small chip size . Chip mounted SD The card is 68mm;eMMC yes 11.513mm; 　　 About their size and packaging , Let me show you a comparison of the physical picture of this product （ From left to right ） 　　

2： Require small capacity .SD NAND yes 128MB-4GB;eMMC Capacity ≥16GB; 　　

3： Long erasure life is required , Scratch resistant .SD NAND It's built in SLC NAND Flash wafer , The number of erasures can reach 5~10 Ten thousand times ; eMMC Use MLC wafer , Erasure life 3 Thousand times （ non-mainstream ）,TLC wafer , The erasure life is generally 500 Times or so （ Main stream ）. 　　

4： It is required to facilitate welding ,pin Foot less . SD NAND LGA-8 encapsulation , Machine stickers and hand stickers are convenient ; eMMC yes 153 Ball,BGA encapsulation , The difficulty of welding has increased a lot 　

5： Adopted by customers CPU Itself does not support eMMC Interface , It also needs mass storage . This is in MCU Often encounter on the platform . Now CS creation SD NAND It's the only choice . 　　

6： Yes PCB The number of plate layers is required to be relatively small . Many customers make some similar toys , Small household appliances and other products . Basically 2 Laminates are enough . If you use it at this time eMMC, that PCB The board should at least become 4 layer . It will increase the difficulty of hardware wiring and PCB Cost of . 　　

Then when to use eMMC It's more suitable ？ 　　

1, The capacity demand is relatively large .>= 8GB when . 　　

2, Master support eMMC. 　　

3,PCB The board area is large enough and the number of layers > 4 layer . Use eMMC, Need to reserve 11.513mm Space ‘PCB At least 4 Laminate , Blind holes need to be buried ;BGA 153 individual ball,0.5mm Of pin spacing . 　　

Want to know CS creation SD NAND For more information , Please click the link :​ ​http://www.longsto.com/product/31.html.​​ 　　 Dear card friends , Welcome to leilong official website , If you still have doubts or don't understand after reading the article , Please contact us , It's tiring to understand or guess the answer by yourself , Please leave the most troublesome matter to us , There are specialized skills , There is an order in hearing Tao , Leilong development focuses on the storage industry 13 year , Provide small capacity flash solutions .