Share the process requirements for single-layer flexible circuit board

Flexible circuit board can be divided into two types: adhesive flexible board and non adhesive flexible board according to the combination of base material and copper foil . among , Flexibility of non adhesive flexible circuit board 、 Adhesion between copper foil and substrate 、 The flatness and other parameters of the pad are better than those with glue , Therefore, the price of adhesive free flexible board is more expensive than that of adhesive flexible board .

We know flexibility pcb It can be bent , It is usually used when bending is required , If the design or process is unreasonable , Easy to produce microcracks 、 Open welding and other defects . Today, jettoban pcb Xiaobian will discuss with you the relevant knowledge about the process requirements of flexible circuit board . Consider the price , At present, most of the market is flexible pcb The board is still flexible with glue pcb.
flexible Pcb According to the number of layers of conductive copper foil, it can be divided into ： Single panel 、 Double deck 、 Multilayer board and double-sided board, etc , Below is a single-layer flexible pcb For example , Explain the process requirements of flexible circuit board .

After cleaning, use the rolling method to combine the two . Then, the exposed pad shall be electroplated with gold or tin for protection . such , The big board is ready . In general, it is necessary to punch small circuit boards into corresponding shapes .

Single layer flexible pcb It belongs to the simplest flexible circuit board , Raw materials are purchased in two ways ： Substrate + Transparent adhesive + Copper foil and protective film + Transparent adhesive . By etching the copper foil and other processes, the required circuit can be obtained ; The protective film shall be drilled to expose the corresponding pad . After cleaning the two, use the rolling method to combine the two , The exposed pad part is protected by electroplating gold or tin , This is how the big board is made . In general, it is necessary to punch small circuit boards into corresponding shapes .

 

Of course , There are also those that do not require a protective film to directly print a solder mask on the copper foil , The mechanical strength of the circuit board will be poor , But the production cost is relatively low , This method is generally used in those occasions where the strength requirements are not high and the price requirements are low . But Xiaobian still suggests that you should stick a protective film .

The above is the relevant knowledge about the process requirements of single-layer flexible circuit board , I hope it helped you .

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