The total investment is 60billion! Foxconn semiconductor high-end package test project officially settled in Qingdao

4 month 15 Japan , Qingdao West Coast new area and Foxconn Technology Group carried out through online video “ Cloud signing ” Activities , Foxconn semiconductor high-end packaging and testing project officially settled . The project will expand the integrated circuit industry chain of Qingdao West Coast New Area , Promote the transformation and upgrading of the integrated circuit industry in the new area and even Qingdao , Boost high-quality economic and social development .

according to the understanding of , Foxconn semiconductor high-end packaging and testing project is jointly invested by Foxconn Technology Group and fusion Holding Group Co., Ltd , The world's leading fan-out packaging and wafer bonding and stacking packaging technology will be used , Package the currently rapidly growing demand 5G Communications 、 Application chips such as image sensors and artificial intelligence . The project is planned to start construction this year ,2021 Annual commissioning ,2025 Annual production capacity .

“ Foxconn semiconductor's high-end packaging and testing project is chip design 、 The core link in the manufacturing and application industry chain , To open up the upstream and downstream industrial chain 、 Accelerating industrial upgrading plays a leading role ”. Liu Yangwei, chairman of Foxconn Technology Group, said , Foxconn will work with Qingdao to promote industrial chain development and high-end technological innovation , Cooperate to promote future urban construction , Let more future industries land in Qingdao , Create a new industrial ecosystem , Cultivate electronic information industry clusters for Qingdao 、 Contribute to the development of industrial Internet .

The data shows , Foxconn Technology Group is the world 500 Strong enterprise , It is also the largest technology manufacturing service provider in the electronic industry in the world . But in recent years , Foxconn is also rapidly deploying the integrated circuit industry . Not only invested in many enterprises , It also cooperates with many local governments to invest in semiconductor projects . In terms of foreign investment , Foxconn has invested in several semiconductor related enterprises , Such as semiconductor equipment manufacturer JINGDING precision technology 、 Semiconductor module packaging and testing manufacturer, chip technology 、LCD Driver ICs Design enterprise Tianyu Technology 、 Semiconductors and LED Manufacturing equipment manufacturer Peixin energy technology 、 as well as IC Design service company Hongjing Technology .

before , Foxconn has successively cooperated with Zhuhai 、 jinan 、 Nanjing and other places have signed cooperation agreements , Invest and build semiconductor industry projects locally .