Written examination questions, answers and analysis of Digital IC design and FPGA design (2) 2021 Huawei Hisilicon (Part 1)

introduction

         Recently, I received many letters from fans , Ask for a version 《 Numbers IC Design 、FPGA Design autumn strokes pen test questions 》, therefore , Through working overtime for several days and nights , Finally came out this edition 《2021 Huawei Hisilicon qiuzhao written test questions 、 answer 、 analysis 》, After every 7 Days will produce several sets of rolls , Help you figure IC Designers get high salaries from big factories Offer！！！

        PS： Pure topic purpose PDF The version can be obtained by contacting the blogger ~

Single topic selection

1、 The main factors affecting chip cost are Die Size And encapsulation , But power supply 、 Clock and other factors , In particular, power consumption has a great impact on the cost of the solution , Therefore, low-cost design needs to take into account low-power design ：（）

A. error

B. correct

 right key ：B
 Detailed analysis ： It has been stated in the title ,“ The main factors affecting chip cost are  Die Size  And encapsulation ”, So what does the packaging cost have to do with , Of course, it's heat dissipation , The more power consumption , The higher the requirements for heat dissipation devices , More difficult to package , Higher cost requirements , therefore , Power consumption is cost related .

2、reg [31:0] big_vect; that big_vect[0+:8] How much is the ？（）

A. big_vect[0:7]

B. big_vect[7:0]

 right key ：B
 Detailed analysis &#x