当前位置:网站首页>Hardware development notes (VII): basic process of hardware development, making a USB to RS232 module (VI): creating 0603 package and associating principle graphic devices
Hardware development notes (VII): basic process of hardware development, making a USB to RS232 module (VI): creating 0603 package and associating principle graphic devices
2022-06-27 12:59:00 【51CTO】
Preface
With the schematic diagram , Can design hardware PCB, In the design PCB There is also a coordinated priority action , Mapping encapsulation , The components of the schematic library are designed by us . In order to better describe the packaging design process , This paper describes the chip resistor capacitor 0603 Chip packaging , Create PATCH PADS , Connect the components of the schematic diagram to the pin package .
<br>
Schematic packaging analysis

- Serial number 1:USB Port packaging , see datasheet establish
- Serial number 2:CON encapsulation , Use dip2.54,2dip
- Serial number 3:ASM1117-3.3V encapsulation , see datasheet establish
- Serial number 4:CON encapsulation , Use dip2.54,3dip
- Serial number 5: Capacitor package , choose 0603 establish
- Serial number 6:CH340G encapsulation , see datashee establish
- Serial number 7: Crystal oscillator package , see datasheet establish
- Serial number 8:MAX232 Component packaging , see datasheet establish
- Serial number 9:CON encapsulation , Use dip2.54,5dip
above , Actually com There is a universal ,0603 These are also general standard packages .
<br>
establish 0603 encapsulation
0603 Mainly capacitance , Common packaging for basic sensors such as resistors .
The same resistance has different power ,0805 The power is 1/8W,0603 The power is 1/10W, So the power of the two is different .
The capacitance is generally different from the withstand voltage ,0805 The maximum operating voltage and the maximum load voltage are 400V and 800V,0603 The maximum operating voltage and the maximum load voltage are 200V and 400V, So the withstand voltage of the two is different .
0603 Package dimension drawing of

Other similar package dimension drawings ( Indicative only )



establish Pad Pad ( Rectangle ,SMT Patch pad )






see :

establish 0603 Component packaging










Delete the superfluous C, The reservation is top Of :

Delete pin serial number :

<br>
Schematic Association encapsulation
Step one : Open the schematic project


Step two : Double click the component to add the package


边栏推荐
猜你喜欢

今日睡眠质量记录78分

【动态规划】—— 背包问题

【医学分割】unet3+

基于SSM实现招聘网站

An interesting experiment of netmask

Details of istio micro service governance grid traffic management core resource controller

Neo4j: basic introduction (I) installation and use

Today's sleep quality record 78 points

Teach you how to build a permanent personal server!

Picocli getting started
随机推荐
不一样的习惯
JMETER连接DM8
硬件开发笔记(七): 硬件开发基本流程,制作一个USB转RS232的模块(六):创建0603封装并关联原理图元器件
ACL 2022 | TAMT proposed by Chinese Academy of Sciences: TAMT: search for a portable Bert subnet through downstream task independent mask training
深信服X计划-系统基础总结
外包2年的我终于上岸了!记录我的字节跳动3轮面试,希望帮助到大家!
application. Configuration information of properties
【医学分割】unet3+
如何修改 node_modules 里的文件
Two TCP flow control problems
云原生(三十) | Kubernetes篇之应用商店-Helm
Read a poem
[medical segmentation] unet3+
First encounter with dynamic programming
数字化新星何为低代码?何为无代码
Privacy computing fat offline prediction
Istio微服务治理网格流量管理核心资源控制器详解
抖音实战~公开/私密短视频互转
昨天访问量破记录
build. Gradle configuration