Ad20 learning notes II

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title: AD20 Study note 2
date: 2020-02-14 22:31:22
tags:

AD Link to learning note 1

AD Link to learning note 3

Continue to organize

21. Import CAD Plate and frame structure ,

FI Inside DXF/DWG, Select the file path , Set the scale mm,1:1, Future generations PCB The layer is introduced into the mechanical layer II , Click ok .

22. Plate and frame definition

Pick a line , Press TAB, All connected lines are selected , Switch to the first mechanical floor ,shift+s Select the board frame and press DSD

23. Mounting holes ：

Cancel plated Nonmetallic L Switch 3D, Choose MS Move .

24. Ignore pad spacing within the same package ：

DR——Electrical Under Options Clearance Ignore pad spacing in .

25. Screen printing becomes smaller ：

Select a silk screen , Right click to find similar objects , change text height and Stroke Windth Recommended values for 10,5moil.CTRL+A Future generations ,AP Change identifier position .

26. Layout skills

First, according to the signal line , Each module , Roughly determine the upper case device （mcu, Connector ) , Then determine the position of the small period according to the schematic diagram , Highlight the component signal trend , Optimize the location , Direction, etc .

27. Device layer shifting

Press... While dragging L Move from top to bottom

28. Crystal oscillator

Crystal Π Type filtering , Crystal oscillator +2 Resistance . The frame of crystal oscillator shall be surrounded by grounding wire ,AGND Is simulated , and GND To separate .

29.PCB Figure find the corresponding original in the schematic diagram

TC, Better use in the split interface

30. There is a problem with the schematic

If you find that pcb There is a problem with the schematic diagram in the layout , You can change it directly in the schematic , Then re import pcb In the figure .

31. Rule settings

Routing rule settings DR

1. Spacing rules (all,  Through hole - Copper skin , Copper skin to all,6mil recommend   4mil）

2. Lineweight rules    Priority settings （ Signal line width （ impedance 50Ω,456moil）, The power cord is bold 15moil, Differential line （ Class creation DC, stay differential part classes  Add a class 90,100  , Confirm the... In the lower right corner of the back point card PCB, The first option is , stay differential part editor, Select a class to add a signal or create a signal from the network + -  p nm Point Rule Wizard 575757+  ）6 4 5）

3. Copper clad rules ： Copper coating method ： In the rules  plane --
	 The third positive  —— How to connect   ——  Flower pad （ Weld yourself ）   Full connection （ recommend ）  Not connected  
	 The second negative layer is 7MOIL
4. General settings for resistance welding 2.5moil     Green wall 4moil above , 

5. Silk screen printing rules  ：
 The rules ——manufacturing——silk to solder —— Minimum distance between object and screen printing  2MOIL

32. About via

1. First, punch holes to occupy space ,12.24moil Check the cap oil ： Low roof tented,tented
2. Change the default via ： Set up ——PCB editor——Defaults——via

33. Copper laying problem

1. Fully connected , Not all connections found , Select copper sheet , Set up pour over all net And check remover dead copper .
2. Change the default via ： Set up ——PCB editor——Defaults——polygon3

34 Automatic wiring ：

Automatic wiring ： paneis—>pcb Activeoute
1. First option :Tune selectd Check ,ALT+ Hold down the left mouse button and drag to select the line to be laid , And then wiring Activeroute
2. The third option ： Routing wizard , You can select the layer to route , It can be punched .

35. Routing

1. Only the signal wiring of the display device ： Select the device ,N Display device , Check power connection hidden .
2.um Multiple routes ,
3.shift+r Ignore obstacle routing
4.DM Reset DRC

36. About laying copper for power supply

Analog ground and power supply are different from digital ground and power supply , Isolate on the negative film layer . Double click quarantine to add network .

37. Reduce interference

1.RJ45 Interference suppression methods : Excavate all layers ,P——> Polygon rectangle hollowing out
2. Place a through hole at the place where the layer is changed gnd
3. suture GND hole ：THA, Constraint area —— grid 150mil—— size 12.22—— Select the network GND—— Forced oil capping —— determine （ The premise is covered with copper ）
4. Bottom and top copper cladding ！！

38. Screen printing adjustment

1. Select a silk screen , Right click —— Find similar objects —— The first option is same determine —— size 30.5mil（6 times ）
2. Select a component , Only turn on device selection , Select all devices ,AP Adjust the screen printing position
3. Right lower corner paneis——view You can select only one layer to view .
4. View V You can turn the board down

39.LOGO

1.LOGO Become a monochrome bitmap —— Import —— transformation ——paneis——properties—— choice logo—— Change the layer to topoverlay
2. Future generations LOGO Right click —— union , Select the union again and resize .
3. Add identification on the screen printing layer ： Add string to silk screen layer —— Format changed to turn type

40DRC Check

TD—— Stop monitoring and select a larger one —— Rules of choice —— function

41 put file in order

Add notes to each layer , Add measurement on the mechanical layer

1.gerber File output 
	FF——gerber Files—— Universal inch scale 2：4—— Paint layer select used —— Select remove all mirror layers —— Select all above the first floor of the machine —— Select the unconnected middle layer pad —— Drilling layers —— Select all big options —— senior ——xyz Add one more 0—— determine ——pameis——CAMtastic 
	
2. Drilling documents 
	FF——NC Drill files—— determine 
3.ipc Net watch 
	FF——test point report—— Format selection IPC—— determine 
 above 3 Items may not be saved ,

4. Assembly drawings :
	FM—— Current document ——next——pab Print settings —— Right click on the first big option —— establish Assmbly Drawings
5.bom surface 
	 The report R The first option of —— Choose output content —— Output format , Templates ——export
6. Coordinate file ：
	FB——generates pick...—— Default —— determine .