Jielizhi Bluetooth headset quality control and production skills [chapter]

When designing the hardware of the earphone board , In addition to performance, priority should be given to the reliability of production .
1、PCB When designing, the rear solder joint shall be as far away from the components as possible , The distance between welding points shall be widened as far as possible .
2、 The battery solder joint shall be as far away from the low-voltage power supply part of the board as possible , Such as ：DCDC Inductance and capacitance ,BTAVDD capacitance ,VDDIO
Capacitance, etc , Stay away from DAC Network related materials . Avoid the battery positive pole touching the low-voltage power supply and DAC. 3、 If the board structure allows , Horn solder joint and battery solder joint shall be arranged on two sides as far as possible （ Rod earphone ）. Board knot
When the structure does not allow the layout of solder joints on both sides , The negative pole of the battery is placed on the positive pole and DAC Between , separate DAC And electricity
Pool positive solder joint .
4、 Try to make the screen printing of solder joints clear , It is convenient for subsequent production to distinguish solder joints .
5、 Design time LDOIN Add one-way on the charging input pin TVS tube （0402 encapsulation ）, Avoid charging surge damage
chip