Unable to stop it, domestic chips have made another breakthrough, and some links have reached 4nm

Chip manufacturing is undoubtedly the most valued part of domestic chips , But for a variety of reasons , As a result, chip manufacturing cannot keep up with the pace of chip design , But this does not mean that chip manufacturing will stagnate , Recently, Changdian technology, one of the domestic chip manufacturers, said it had achieved 4nm Mobile phone chip packaging , It can improve the performance of the chip .

Changdian technology said it had 4nm Mobile phone chip packaging technology , It can undertake mobile phone chips produced by chip foundries such as TSMC , take CPU、GPU And RF chip integrated packaging , Compared with the previous chip packaging technology , The packaging technology of Changdian technology is conducive to improving the overall performance of mobile phone chips , Reduce power consumption , At the same time, reduce the volume , It is very important for such a precision machine as mobile phone .

The industry may be interested in TSMC 、 Samsung mass production 4nm for having heard it many times , Advanced technology helps to improve the performance of the chip 、 Reduce power consumption , For mobile phone chips, due to the small size of mobile phones , Therefore, it is more necessary to adopt advanced technology to obtain better performance 、 Power consumption performance , And for chips , In fact, in addition to manufacturing , And the sealing and testing link is also very important .

The sealing and testing link is to integrate TSMC 、 Samsung and other chip manufacturing enterprises produce qualified wafers for cutting 、 Welding wire 、 Plastic encapsulation , This process also requires high technology , Ensure that the wafer is not damaged during cutting , Then connect the chip circuit with external devices to realize electrical connection , Then protect it with proper packaging , Finally, the function and performance of the packaged chip are tested , Ensure that the chips delivered are qualified products .

With the advanced technology getting closer to the bottleneck , In addition, the cost of advanced technology is becoming more and more expensive , Chip design enterprises and chip manufacturing enterprises have begun to seek changes in Packaging Technology , When stepping down, Jidian 、Intel And so on chiplet The alliance hopes to package various types of chips with advanced packaging technology , Enhance the data transmission efficiency of various chips , And improve performance , Reduce chip manufacturing costs , Changdian technology is just one of the top three sealing and testing enterprises in the world , It has reached the world leading level in advanced packaging technology , Naturally, it also helps to enhance the overall strength of Chinese chips .

Advanced packaging technology has now become an important technology pursued by the global chip industry , TSMC 、Intel Etc chiplet The alliance promotes their packaging technology , Huawei Hisilicon in Chinese Mainland has also obtained a chip stacking technology patent , Now, Changdian technology has caught up with the world's advanced level in advanced packaging technology , It can be seen that packaging technology has become the focus of competition .

Industry insiders speculate that Huawei may adopt chip stacking technology to improve chip performance on mobile phone chips , This is mainly because the current chip production process in China is far behind that of TSMC , And chip stacking technology can effectively improve chip performance , In this way, Hisilicon chip plus chip stacking technology produced by mature technology can meet the performance needs of consumers .

Of course, for chips , Finally, we need a breakthrough in chip manufacturing process , Previously, industry insiders pointed out that in addition to the progress made in packaging technology in the domestic chip industry chain , In the eight links of chip manufacturing, only the lithography machine is blocked , Other chip manufacturing links have broken into 14nm, Among them, the etching machine has progressed to 5nm, This means that at least two links of domestic chips have progressed to 5nm above .

As for the lithography machine , It is said that China will walk on two legs , On the one hand, we will continue to strive to overcome the key components of the lithography machine , Strive to realize the localization of advanced lithography machines , On the other hand, it is seeking to develop chip manufacturing technology without photolithography , There are Japanese NIL Provide reference for process , Japan's NIL The craft has been used by the armor man NAND flash Memory chip production , Allegedly 2025 Years will be available for 5nm Production of process , Domestic chip manufacturing is also said to be working in this direction .

in general , In any way , China is working hard to promote all aspects of chip , Any progress that can be made is amazing , After all, the meal should be eaten in one bite , When other links are ready for advanced technology , So when the problem of the lithography machine is solved , Domestic advanced technology can be launched immediately , Only with enough preparation can we harvest fruits faster .