Comparison of solutions of Qualcomm & MTK & Kirin mobile platform USB3.0

qualcomm 、 Kirin platform and MTK All mobile platforms support USB3.0 Design , However, the design differences of several platforms are relatively large . Make a summary and comparison as follows , For those who need it .

One .Qualcomm Design
Qualcomm There is USB3.0 Two pairs of difference lines , in addition Type-C Positive and negative insertion , altogether 8 Root routing . At present, customers are directly connected from baseband to Type-C Interface , Of course, protective devices need to be added in the middle .

Qualcomm platform is used in the market USB3.0 All mobile phones have glory 、OPPO、VIVO, Their design is as follows .

1. glory Magic4 pro Qualcomm SM8450 Snapdragon 8 Gen 1 (4 nm)
adopt BTB Receive Type-C Interface ,BTB Parallel connection at the connector TVS, Series connection 1 Particle resistance , The baseband side is connected in series with a small capacitor , Then it receives baseband TX/RX Pin .

2.OPPO Find X3 Pro Qualcomm SM8250-AC Snapdragon 870 5G (7 nm)
adopt BTB Receive Type-C Interface ,BTB Series capacitance at the connector , parallel connection TVS, Series capacitors , Then it receives baseband TX/RX Pin .

3.VIVO X70 Pro+ Qualcomm SM8350 Snapdragon 888+ 5G (5 nm)

VIVO There are several mobile phones to support USB3.0,VIVO The design scheme of has not been obtained , Should be and OPPO Similar to the glory , After getting it, I will add .

Two .MTK MT6853/MT6873 platform
MTK The reference design of seems more complicated ,MT6853/MT6873 The reference design of is as follows ：
Baseband only 4 Root routing .

After that, we need USB 3.0 Transfer driver IC PTN36241G and USB3.0 High speed 2:1 Data switch FUSB340TMX.

Finally connected to Type-C Interface .
We haven't seen the use of MT6853/73 Platform support USB3.0 The mobile phone , notice Find X5 Tianji version supports USB3.0, I don't know how to design , I'm not sure if I still need a transfer drive IC PTN36241G and USB3.0 High speed 2:1 Data switch . Later I learned that it is updating .

3、 ... and . Hisilicon kylin platform
Huawei P40 Pro Use Unicorn Kirin990 5G(7nm), It seems that the solution is the same as Qualcomm's , Baseband yes 4 On the difference line , No transfer drive is required IC G and USB3.0 High speed 2:1 Data switch .
Huawei P40 Pro The design is as follows .
BTB Side parallel TVS tube , The baseband side is connected in series 100nF capacitance .

Welcome to follow individual public number , Some problems and knowledge points encountered in the later work will be summarized and sent to official account , Make a record . I have schematic diagrams of several mobile phone customers , And all aspects of program design , Welcome to exchange .